Thermal Management Components
Custom Copper Cold Plates, Aluminum Heat Sinks & Liquid Cooling Solutions — Precision CNC Machined for AI Servers, Data Centers & High-Power Industrial Applications
- On‑time delivery
- Extensive experience
- Professional technical knowledge
- Rapid Prototyping Services
Core Data
| Data | Value | description |
| Heat Flux Capacity | 1,000–2,500 W | Per cold plate for high-power AI chips |
| Microchannel Width | 0.3–2.0 mm | Precision CNC-milled copper channels |
| Base Flatness | ±0.01 mm | Lapped contact surface for minimum thermal resistance |
| Prototype Lead Time | 7–15 days | From drawing approval to first article |
Related Products
AI Server Cold Plates
Copper C11000 microchannel cold plates engineered for GPU and AI accelerator cooling. Direct-to-chip design with precision-milled 0.3–2.0 mm channels, vacuum-brazed or FSW construction, and electroless nickel plating for corrosion protection. Thermal simulation support available from design stage.....
Liquid Cooling Plates & Water Blocks
Serpentine and parallel-channel liquid cooling plates for power electronics, inverters, and industrial cooling. Available in copper, aluminum, or hybrid construction with deep-drilled or brazed flow paths. Custom port configurations and mounting interfaces for seamless integration....
CNC Machined Heat Sinks
High-performance aluminum and copper heat sinks manufactured by precision CNC milling and skiving. Fin densities up to 60 fins per inch, base thickness from 2–20 mm, and custom mounting patterns. Anodizing, powder coating, and nickel plating available...
Vapor Chamber Base Plates
Flat heat spreaders and vapor chamber bases for uniform temperature distribution across high-heat-flux surfaces. Copper or aluminum construction with internal wick structures, supporting heat loads from 500–2,000 W. Ideal for LED, laser, and power module applications....
Battery Cooling Plates
Liquid cooling plates for EV battery packs and energy storage systems (ESS). Serpentine or microchannel designs optimized for cell-to-plate thermal interface, with aluminum or copper construction and leak-tested to 10 bar. Compatible with cylindrical, prismatic, and pouch cell formats.....
Skived & Bonded Heat Sinks
Skived fin heat sinks for high-power applications requiring dense fin arrays in a single piece of copper or aluminum — no thermal interface resistance between base and fins. Bonded fin heat sinks available for larger formats with mixed-material construction. Fin thickness from 0.1 mm.....
Core Manufacturing Capabilities
CNC Microchannel Milling
3- and 5-axis CNC machining centers mill precision microchannels as narrow as 0.3 mm in copper C11000 and aluminum 6061-T6. Channel geometry optimized via CFD simulation for balanced flow distribution and maximum heat transfer.
Skiving
Single-piece skiving produces fin arrays with zero thermal resistance between base and fins — critical for high-heat-flux applications. Capable of fin thicknesses down to 0.1 mm and fin heights up to 80 mm in copper and aluminum.
Vacuum Brazing
Vacuum furnace brazing creates leak-tight, metallurgical bonds between cold plate layers without flux residue. Ideal for copper microchannel cold plates requiring high structural integrity and long-term reliability under pressure cycling.
Friction Stir Welding (FSW)
FSW produces solid-state welds with no melting, ideal for aluminum and copper-aluminum hybrid cold plates. Superior mechanical properties and leak resistance compared to fusion welding, suitable for high-pressure liquid cooling systems.
Deep Hole Drilling
Gun drilling and deep hole drilling produce straight, precision flow paths in solid copper or aluminum billets — ideal for serpentine channel cold plates where brazed construction is not preferred. Hole diameters from 3–20 mm, depth-to-diameter ratios up to 50:1.
Custom Thermal Management Components Material Solutions
Choosing the right material is the first step in optimizing thermal performance, weight, and cost. Our engineering team helps you select the optimal material based on your heat load, coolant type, weight constraints, and budget.
| Material | Thermal Conductivity | Key Advantages | Typical Applications |
|---|---|---|---|
| Copper C11000 / T2 | ~398 W/m·K | Highest conductivity, excellent corrosion resistance with nickel plating | AI server cold plates, high-heat-flux liquid cooling |
| Aluminum 6061-T6 | ~167 W/m·K | Lightweight, cost-effective, easy to anodize | Battery cooling plates, general heat sinks, power electronics |
| Aluminum 6063 | ~201 W/m·K | Better extrudability, smooth surface finish | Extruded heat sinks, LED cooling, low-to-medium power |
| Cu-Al Hybrid | Combined | Copper base for heat spreading + aluminum fins for weight/cost optimization | High-performance air-cooled heat sinks, weight-sensitive applications |
| Stainless Steel 304/316 | ~15–20 W/m·K | Corrosion resistance, high pressure capability, biocompatible | Corrosive fluid cooling, medical, food & beverage |
Technical Specifications
Standard capabilities across our thermal component manufacturing range. Custom specifications available upon request — our engineering team reviews every project for feasibility and optimization.
| Parameter | Standard Specification | Custom Options |
|---|---|---|
| Heat Flux Capacity | 1,000–2,500 W per cold plate | Up to 5,000 W with enhanced microchannel design |
| Microchannel Width (CNC) | 0.3–2.0 mm | Down to 0.15 mm with specialized tooling |
| Skived Fin Thickness | 0.1–1.0 mm | Down to 0.05 mm on request |
| Skived Fin Height | Up to 80 mm | Custom heights available |
| Base Flatness | ±0.01 mm (lapped) | ±0.005 mm with precision grinding |
| Machining Tolerance | ±0.005 mm (critical dimensions) | ±0.002 mm with jig grinding |